JRPanel is a one-stop smart manufacturer with many years of experience in manufacturing electronics and industrial products with many years of PCB manufacturing experience. Advanced PCB is now launched to realize a more convenient procurement platform for customers.
JRPanel can provide many types of PCB manufacturing, such as: Multilayer PCB, HDI PCB, Rogers High Frequency PCB, Buried & Blind PCB, Rigid-Flex PCB, Flexible PCB, Metal Base (core) PCB, High TG Thick Copper PCB.
The production of PCB requires complex processes, and each step must be carefully and meticulously, and every process
has to be tested to ensure that the PCB is produced correctly.
Technical Index | Mass Batch | Small Batch | Sample | ||
---|---|---|---|---|---|
Base Material | FR4 | Normal Tg | Shengyi S1141、KB6160、Huazhen H140 (not suitable for lead free process) | ||
Middle Tg | For HDI、Multi Layers: SY S1000H、ITEQIT158、HuazhengH150; TU-662 | ||||
High Tg | For Thick Copper、High Layer: SY S1000-2; ITEQIT180A; HuazhengH170; ISOLA:FR408R; 370HR; TU-752; |
||||
Halogen Free | Middle Tg: SY S1150G、HuazhengH150HF、H160HF; High Tg: SY S1165 | ||||
High CTI | CTI≥600 SY S1600、Huazheng H1600HF、H1600A | ||||
High Frequency | Rogers、 Arlon、Taconic、SY SCGA-500、S7136; HuazhengH5000 | ||||
High Speed | SY S7439; TU-862HF、TU-872SLK; ISOLA: I-Speed、I-Tera@MT40 Huazheng: H175、H180、H380 |
||||
Flex Material | Base | Glue-free: Dupont AK Xingyang W-type, Panosonic RF-775 | |||
Coverlay | SY SF305C、Xingyang Q-type | ||||
Special PP | No Flow PP: VT-447LF, Taiguang 370BL Arlon 49N Ceramic Filled Adhesive Sheet: Rogers4450F PTFE Adhesive Sheet: Arlon6700、Taconic FR-27 / FR-28 Double-sided CoatingPI: Xingyang N-1010TF-mb |
||||
Metal Base | Berguist Al-base 、Huazheng Al-base、Chaosun Al-base、Copperbase | ||||
Special | High Heat Resistance Rigidity PI: Tenghui VT-901、Arlon 85N、SY S260 (Tg250) High Thermal Conductivity Material: 92ML Pure Ceramic Material: Alumina Ceramic、Aluminum Nitride Ceramics BT Material: Taiwan Nanya NGP-200WT |
||||
Layers | FR4 | 24 | 36 | 64 | |
Rigid & Flex / (Flex) | 16 (12) | 20 (12) | 24 (16) | ||
High Frequency Mixed Lamination | 12 | 18 | 24 | ||
100% PTFE | 4 | 12 | 18 | ||
HDI | 2 steps | 3 steps | 4 steps | ||
Delivery Size (mm) | Max (mm) | 460*560 | 460*560 | 550*900 | |
Min (mm) | 20*20 | 10*10 | 5*10 | ||
Width / Gap | Inner (mil) | 0.5OZ base copper: 3/3 1.0OZ base copper: 4/4 2.0OZ base copper: 5/6 3.0OZ base copper: 7/9 4.0OZ base copper: 8/12 5.0OZ base copper: 10/15 6.0OZ base copper: 12/18 10 OZ base copper: 18/24 12 OZ base copper: 20/28 |
|||
Outer (mil) | 1/3OZ base copper: 3/3 0.5OZ base copper: 4/4 1.0OZ base copper: 5/5 2.0OZ base copper: 6/8 3.0OZ base copper: 7/10 4.0OZ base copper: 8/13 5.0OZ base copper: 10/16 6.0OZ base copper: 12/18 10 OZ base copper: 18/24 12 OZ base copper: 20/28 15 OZ base copper: 24/32 |
||||
Line Width Tolerance | >5.0 mil | ±20% | ±20% | ±1.0mil | |
≤5.0 mil | ±1.0mil | ±1.0mil | ±1.0mil | ||
Copper Thickness | Inner Layer (OZ) | 4 | 6 | 12 | |
Out Layer (OZ) | 4 | 6 | 15 | ||
Board Thickness (mm) | 0.5-5.0 | 0.4-6.5 | 0.4-11.5 | ||
Final Board Thickness | >1.0 mm | ±10% | ±8% | ±8% | |
≤1.0 mm | ±0.1mm | ±0.1mm | ±0.1mm | ||
Board Thickness/drill Bit | 10:1 | 12:1 | 13:1 | ||
Contour | Bevel Edge | 20~60 degree; ±5degree | |||
Bow And Twist | ≤0.75% | ≤0.75% | ≤0.5% |
Technical Index | Mass Batch | Small Batch | Sample | ||
---|---|---|---|---|---|
Drilling | Min Laser (mm) | 0.1 | 0.1 | 0.1 | |
Min CNC (mm) | 0.2 | 0.15 | 0.15 | ||
Max CNC Drill Bit (mm) | 6.5 | 6.5 | 6.5 | ||
Min Half Hole (mm) | 0.5 | 0.4 | 0.4 | ||
PTH Hole (mm) | Normal | 6.5 | 6.5 | 6.5 | |
Pressing Hole | 0.5 | 0.4 | 0.4 | ||
Hole Angle (conical) | Width of upper diameter≤6.5mm:800、900、1000、1100 Width of upper diameter≥6.5mm:900 |
||||
Precision of Depth-control Drilling (mm) | ±0.10 | ±0.075 | ±0.05 | ||
Number of blind CNC holes of one side | ≤2 | ≤3 | ≤4 | ||
Minimum via hole spacing (different network, military, medical, automobile) mm |
0.50 | 0.45 | 0.40 | ||
Minimum via hole spacing (different network, general industrial control and consumer electronic) mm |
0.4 | 0.35 | 0.3 | ||
The minimum hole wall spacing of the over hole (the same network mm) |
0.20 | 0.20 | 0.15 | ||
Minimum hole wall spacing (mm) or device holes | 0.80 | 0.70 | 0.70 | ||
The minimum distance from via hole to the inner copper or line |
0.2 | 0.18 | ≤10L: 0.15 >10L: 0.18 |
||
The min distance from Device hole to inner copper or line |
0.3 | 0.27 | 0.25 | ||
Welding Ring (mil) | Via Hole | 4 (HDI 3mil) | 3.5 (HDI 3mil) | 3 | |
Component Hole | 8 | 6 | 6 | ||
Final Board Thickness | >1.0 mm | ±10% | ±8% | ±8% | |
≤1.0 mm | ±0.1mm | ±0.1mm | ±0.1mm | ||
CNC | Contour Tolerance (mm) | ±0.15 | ±0.10 | ±0.10 | |
V-CUT Tolerance of Residual Thickness (mm) | ±0.15 | ±0.10 | ±0.10 | ||
Routing Slot (mm) | ±0.15 | ±0.10 | ±0.10 | ||
Precision of Controlled Deep Milling (mm) | ±0.15 | ±0.10 | ±0.10 |
Technical Index | Mass Batch | Small Batch | Sample | ||
---|---|---|---|---|---|
Solder Dam (mil) | (solder mask) | 5 | 4 | 4 | |
(hybrid) | 6 | 5 | 5 |
Technical Index | Mass Batch | Small Batch | Sample | ||
---|---|---|---|---|---|
Surface Treatments | Immersion Gold | Ni Thickness (micro inch) |
118-236 | 118-236 | 118-236 |
Max Gold (uinch) | 3 | 3 | 6 | ||
Hard Gold (Au thick) | Gold Finger (uinch) | 15 | 30 | 60 | |
NiPdAu | NI (uinch) | 118-236 | |||
PA (uinch) | 2-5 | ||||
AU (uinch) | 1-5 | ||||
Graph Electric Gold | NI (uinch) | 120-400 | |||
AU (uinch) | 1-3 | ||||
Immersion Tin | Tin (uinch) | 0.8-1.2 | |||
Immersion Ag | Ag (uinch) | 6-10 | |||
OSP | Thick (uinch) | 0.2-0.5 | |||
HAL / HAL LF | BGApad (uinch) | ≥0.3×0.3 | |||
Thickness (uinch) | 0.6≤H≤3.0 | ||||
Board Thickness vs Hole Diameter |
Press hole≤3:1 | ||||
Tin (um) | 2.0-40.0 |
Technical Index | Mass Batch | Small Batch | Sample | ||
---|---|---|---|---|---|
Rigid & Flex | Maximum dielectric thickness of flex | Glue-free 25um | Glue-free 75um | Glue-free 75um | |
Flex part width (mm) | ≥10 | ≥5 | ≥2 | ||
Max delivery size (mm) | 200×400 | 200×500 | 400×550 | ||
Distance of via hole to edge of Rigid&flex (mm) | ≥1.2 | ≥1.0 | ≥0.8 | ||
Distance of components hole to the edge of R & F (mm) | ≥1.5 | ≥1.2 | ≥1.0 | ||
Rigid & Flex | Structure | The outer layer structure of the flex part, the PI reinforcement structure and the separation structure |
Aluminum based rigid flex, rigid flex HDI, combination, electromagnetic shielding film |
Technical Index | Mass Batch | Small Batch | Sample | ||
---|---|---|---|---|---|
Special Tech | Back drilling PCB, metal sandwich, thick copper buried blind hole, step slot, disc hole, half hole, mixed lamination |
Buried magnetic core PCB |
Buried capacitor / resistor, embedded copper in partial area, 100% ceramic PCB, buried riveting nut PCB, embedded components PCB |
In other special cases or Advanced PCBs (you need to choose " Additional Options" and custom stackup or control impedance):
1. If you need custom stackup or control impedance, we will manufacture according to your requirement.
2. After place order, we will calculate whether it meets the requirements based on the stackup, material and impedance information. Also we will confirm with you.
Items | Manufacturing Capabilites | Remarks | |
---|---|---|---|
Number of Layers | / | 1-10 layers | For orders above 10 layers, please view the below "Standard PCB" or contact our sales rep. |
Material | / | FR-4, Aluminum | For Flex, Rigid-flex, Metal-based (Aluminum etc.), HDI, Halogen-free, High Tg, etc., please view the below "Standard PCB" or contact sales rep. |
Maximum PCB Size (Dimension) |
/ | 500*1100mm (min 5*6mm) | pAny sizes beyond this dimension, please view the below "Standard PCB" or contact sales rep. |
Board Size Tolerance (Outline) |
/ | ±0.2mm / ±0.5mm | ±0.2mm for CNC routing, and ±0.5mm for V-scoring. |
Board Thickness | ![]() |
0.2-2.4mm | 0.2, 0.4, 0.6, 0.8, 1.0, 1.2, 1.6, 2.0, 2.4mm. Please view the below "Standard PCB" or contact us if your board exceeds these. |
Board Thickness Tolerance (t≥1.0mm) |
/ | ±10% | Normally "Tolerance" ill occur due to PCB processing steps such as electroless copper, solder mask and other types of finish on the surface. |
Board Thickness Tolerance (t<1.0mm) |
/ | ±0.1mm | |
Min Trace | ![]() |
0.1mm / 4mil | Min manufacturable trace is 4mil (0.1mm), strongly suggest to design trace above 6mil (0.15mm) to save cost. |
Min Spacing | Min manufacturable spacing is 4mil (0.1mm), strongly suggest to design spacing above 6mil (0.15mm) to save cost. |
||
Outer Layer Copper Thickness |
![]() |
1oz / 2oz / 3oz (35μm / 70μm / 105μm | Also known as copper weight. 35μm=1oz, 70μm=2oz, 105μm=3oz. Please view the below "Standard PCB" or contact us if you need copper weight greater than 3oz. |
Inner Layer Copper Thickness |
![]() |
oz/1.5oz (35μm / 50μm) | Inner copper weight as per customer’s request for 4 and 6 layers (Multi- layer laminated structure). Please contact us if you need copper weight greater than 1.5oz. |
Drill Sizes (CNC) | ![]() |
0.2-6.3mm | Min drill size is 0.2mm, max drill is 6.3mm. Any holes greater than 6.3mm or smaller than 0.3mm will be subject to extra charges. |
Min Width of Annular Ring |
![]() |
0.15mm (6mil) | For pads with vias in the middle, Min width for Annular Ring is 0.15mm (6mil). |
Finished Hole Diameter (CNC) |
![]() |
0.2mm-6.2mm | The finished hole diameter will be smaller than size of drill bits because of copper plating in the hole barrels |
Finished Hole Size Tolerance (CNC) |
/ | ±0.08mm | For example, if the drill size is 0.6mm, the finished hole diameter ranges from 0.52mm to 0.68mm will be considered acceptable. |
Solder Mask | ![]() |
LPI | Liquid Photo-Imageable is the mostly adopted. Thermosetting Ink is used in the inexpensive paper-based boards. |
Minimum Character Width (Legend) |
![]() |
0.15mm | Characters of less than 0.15mm wide will be too narrow to be identifiable. |
Minimum Character Height (Legend) |
/ | 0.8mm | Characters of less than 0.8mm high will be too small to be recognizable. |
Character Width to Height Ratio (Legend) |
/ | 1:5 | In PCB silkscreen legends processing, 1:5 is the most suitable ratio |
Minimum Diameter of Plated Half Holes |
/ | 0.6mm | Design Half-Holes greater than 0.6mm to ensure better connection between boards. |
Surface Finishing | ![]() |
HASL with lead HASL lead free Immersion gold, OSP |
The most popular three types of PCB surface finish. Please view the below "Standard PCB" or contact us for other finishes. |
Solder Mask | ![]() |
Green, Red, Yellow, Blue, White, Black | Green, Red, Yellow, Blue, White, Black, Purple, Matte black, Matte green |
Silkscreen | ![]() |
White, Black, None | White, Black, Yellow, Blue, Grey |
Panelization | ![]() |
V-scoring, Tab-routing, Tab-routing with Perforation (Stamp Holes) |
Leave min clearance of 1.6mm between boards for break-routing. For V- score panelization, set the space between boards to be zero. |
Others | / | Fly Probe Testing (Free) and A.O.I. testing (free), ISO 9001:2008 ,UL Certificate |
Fly Probe Testing Testing Fixture A.O.I Testing X-ray ISO9001:2008 UL Certificate |