4 Soldering Factors That Affect the Stability of the Circuit Boards

Label:Electronics Industry, Circuit Boards, Soldering Process

Oct 18, 20216240

4 Soldering Factors That Affect the Stability of the Circuit Boards


As an important part of the electronics industry, circuit boards are widely used in the electronics industry. Therefore, the circuit board production process is relatively strict.

 

The circuit board is a high-end product. During the circuit board soldering process, if the soldering quality is not good, the stability of the circuit components in the circuit board will be affected, causing the circuit board to malfunction.

 

So in the soldering process, what factors should we pay attention to?

 

1. In the process of circuit board soldering, the composition of the soldering material and the nature of the solder will directly affect the quality of the circuit board soldering, mainly including: electrodes, soldering tin and other related soldering materials. In addition, the chemical reaction in the soldering process should be paid attention to when soldering. The chemical reaction is an important part of the circuit board soldering process, and the main function is to link the circuit board channels.

 

2. There are many ways to solder the circuit board. When soldering, we need to choose the soldering method according to the specific situation. The main basis is to choose according to the melting point of the solder. Remember not to choose soldering materials casually. When setting the temperature of the soldering device, the value must be higher than the melting point of the soldering material. As for the circuit board flux, we generally choose white rosin and isopropanol solvents.

 

3. During the circuit board soldering process, whether the surface of the circuit board is clean or not will directly affect the quality of the soldering. If the surface of the circuit board is not clean enough, it will directly turn the tin wire into a tin ball, and the tin ball lacks luster.

 

4. The temperature during soldering is also an important factor. When the temperature is too high, the speed at which the solder melts and disperses will increase and the activity will increase. This will accelerate the oxidation reaction of the molten solder, and ultimately lead to the circuit board soldering quality that does not meet the requirements.



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