PCB package is to graphically express various parameters of actual electronic components (such as component size, length and width, in-line, patch, pad size, pin length and width, pin spacing, etc.) Out so that it can be called when drawing the PCB diagram.

 

According to the installation method, it can be divided into mounted devices, plug-in devices, mixed devices (mounting and plug-in devices exist at the same time), and special devices. Special devices generally refer to sinking board devices.

 

If distinguished by function and device shape, we can divide PCB Package into the following categories:

 

SMD: Surface Mount Devices

 

RA:Resistor Arrays

 

MELF：Metal electrode face components

 

SOT：Small outline transistor

 

SOD：Small outline diode

 

SOIC：Small outline Integrated Circuits

 

SSOIC:Shrink Small Outline Integrated Circuits

 

SOP:Small Outline Package Integrated Circuits

 

SSOP:Shrink Small Outline Package Integrated Circuits

 

TSOP:Thin Small Outline Package

 

TSSOP:Thin Shrink Small Outline Package

 

SOJ:Small outline Integrated Circuits with J Leads

 

CFP:Ceramic Flat Packs

 

PQFP：Plastic Quad Flat Pack

 

SQFP：Shrink Quad Flat Pack

 

CQFP：Ceramic Quad Flat Pack

 

PLCC：Plastic leaded chip carriers

 

LCC：Leadless ceramic chip carriers

 

QFN:Quad Flat Non-leaded package

 

DIP：Dual-In-Line components

 

PBGA：Plastic Ball Grid Array

 

RF：Radio Frequency

 

AX：Non-polarized Axial-Leaded Discretes

 

CPAX：Polarized capacitor, axial

 

CPC：Polarized capacitor, cylindricals

 

CYL：Non-polarized cylindricals

 

DIODE

 

LED：Light-emitting diode

 

DISC：Non-polarized Offset-leaded Discs

 

RAD：Non-polarized Radial-Leaded Discretes

 

TO：Transistors Outlines

 

VRES：Variable resistors

 

PGA：Plastic Grid Array

 

RELAY：Relay

 

SIP：Single-In-Line components

 

TRAN：Transformer

 

PWR：Power module

 

CO： Crystal oscillator

 

OPT：Optical module

 

SW： Switch

 

IND：Inductance