Label：HASL, Immersion White Tin, OSP, ENIG
Dec 2, 202114260
PCB surface finishing is used for 2 things. First is to protect the exposed copper circuitry and second is to ensure solderability. The difference in material used will affect the price, shelf life, reliability and assembly processing.
This is the predominant method that has been dominating for a long time. This finish requires immersing circuit boards into a tin/lead alloy then removing the excess solder by blowing hot air to it.
Tin is directly applied to the base metal, an affordable option compared to other surface finishing. When tin and copper are mixed together they will diffuse into one another due to its affinity properties.
OSP prevents the copper from oxidation by applying a very thin water-based organic compound. It is very environmentally friendly compare to other more toxic compounds used. It is a low cost solution and a fairly popular option as well.
This is the best surface finishing used today as it allows a flat surface with excellent solderability despite a higher cost. When applied the gold actually dissolves into the solder so that it won’t tarnish or oxidize. It is a 2-layer process by layering nickel on top of copper first than adding a finishing layer of gold.
A midrange cost finishing that is popular for North America and Europe due to RoHS and WEEE regulation. A good alternative to ENIG if you want good properties at a lower cost.
Want to know more about JRPanel ? Welcome to save JRPanel's Community to your browser favorites!