4 Types of Inspection Items for PCBA

Label:PCBA

Dec 13, 20236682

4 Types of Inspection Items for PCBA

The process flow of PCBA is complex, including printed circuit board manufacturing, component procurement and inspection, SMT patch assembly, DIP plug-in, PCBA testing, etc. Functional testing is something that provides a simulated operating environment for the test target to work in various design states, thereby obtaining the parameters of each state to verify the functionality of the PCBA. Usually, inspection items are divided into four categories: material inspection, process inspection, appraisal inspection and quality consistency inspection.

 

1. Material inspection

 

Material inspection is an important part of the quality control of production process. It is also part of the quality assurance of the product, proving that the materials used in PCB have passed the re-inspection. When we need to check the materials of finished boards, material inspection can be used as proof that the material quality complies with the design documents or order contracts.

 

Material inspection should consist of the original product certificate from the material SMT factory and the certificate of conformity based on the identification data obtained by PCB manufacturer through counting sampling in accordance with regulations.

 

Critical materials used in PCB production must be retested, including substrates, prepregs, and other process materials. The content of re-inspection should focus on the main parameters that have an impact on the product.

 

For process materials, it is usually necessary to check the material's certification documents and conduct necessary process tests to determine the quality. It is not necessary to test or inspect all properties of the material.

 

2. Process inspection

 

Process inspection is for quality inspection during the production process. It is the basis for ensuring the quality of the final product and an important part of the quality assurance system. We set appropriate inspection points according to our own production quality stability, process characteristics and product quality grade requirements.

 

We implement an inspection method that combines self-inspection, mutual inspection and special inspection. It is difficult to do everything in mass production, but at least there should be self-inspection and special inspection. Inspection points should be set up at least after the photographic plate, hole metallization (completeness of plated holes), etching of inner and outer conductive patterns (detection of wire width and spacing level pattern defects), before coating of solder mask (checking cleanliness).

 

There are inspection records after hole and shape processing, before circuit switching and product packaging. During the production process, key solutions and plating solutions should also be tested regularly or irregularly. The operating status of automated equipment should be checked at any time.


 

3. Appraisal inspection

 

Appraisal inspection is used to prove that PCB suppliers have the ability to produce products specified by standards. It is a certification inspection of their production capabilities and the identification of new products. Inspection shall be performed on products in equipment. The inspection must meet all requirements of the specified product level.

 

4. Quality consistency inspection

 

Quality consistency inspection is performed on the finished printed circuit boards or quality-consistent attachment boards to ensure good delivered products. When using attachment boards, they should be operated according to the graphics and positions on the panels specified in the standard.

 

Each attachment board and its corresponding finished board should be certified to be on the same in-process board. Quality consistency inspection should include Group A inspection (batch-by-batch inspection) and Group B inspection (periodic inspection).


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